On July 10, SK Hynix will launch an initial public offering (IPO) on the Nasdaq, offering approximately 17.9 million shares and targeting gross proceeds of about $28 billion. The capital raised will support the company’s expansion into high-bandwidth memory (HBM) and advanced packaging technologies crucial for AI accelerators.
In recent announcements, Samsung Electronics and SK Hynix have committed to investing a combined $520 billion to build four new memory fabrication plants in South Korea, part of a longer-term plan to invest $2 trillion on related projects. Additionally, Micron Technology is expanding its facility in Japan with a $9 billion investment to boost HBM chip production, alongside a $200 billion investment in new U.S. fabs. As of July 6, Micron and Sandisk are the top two performing stocks in the Nasdaq-100 this year.
Market analysts suggest that continued investment in AI memory infrastructure is likely to support further growth for Micron and Sandisk, backed by ongoing demand from hyperscalers like Amazon, Microsoft, and Alphabet as capital expenditures in AI infrastructure remain elevated.
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