Advanced Micro Devices (AMD) is enhancing its adaptive computing portfolio by introducing native Universal Chiplet Interconnect Express (UCIe) 1.1 connectivity to its Versal RF Series adaptive system-on-chips (SoCs). This technology, expected to become available in the fourth quarter of 2027, enables high-bandwidth communication between AMD devices and specialized co-packaged chiplets, allowing for a more streamlined approach in developing customized solutions across various applications, including AI and communications.
The Versal RF Series will feature up to four UCIe-SP interfaces and two UCIe-AP interfaces, delivering multi-terabit-per-second aggregate in-package bandwidth. Currently, AMD’s embedded revenues have risen 19% year-over-year to $977 million in the second quarter of 2026, with ongoing demand in networking, aerospace, and defense sectors. The company aims for over $18 billion in new embedded design wins, indicating a robust growth trajectory.
However, AMD faces stiff competition from Intel and Microchip, both of which are expanding their market positions in embedded and AI-driven applications. AMD’s share price has surged 124% year-to-date, contrasting with a broader sector return of 15.4%, but its valuation remains high with a forward price/sales ratio of 11.01, compared to the sector’s 5.24.
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