Dow Inc. (DOW) has launched DOWSIL TC-3120 Thermal Gel, a silicone-based thermal transfer material aimed at enhancing heat management in various applications including optical transceivers, electronic module assemblies, autonomous vehicles, and automotive electronic controllers. The gel features a thermal conductivity of approximately 12 W/m·K and is designed for high-performance applications that support 800G and 1.6T optical modules.
DOWSIL TC-3120 Thermal Gel minimizes risks of contamination in optical components, improving long-term reliability by reducing interference with adhesion. It is now available globally as part of Dow’s Cooling Science portfolio and can be pressed to a bondline thickness of 200 microns, effectively filling large gaps. The material is resistant to high temperatures, humidity, vibration, and thermal cycling.
In the past year, DOW’s stock has increased by 24.1%, outperforming the industry’s average growth of 12.2%.
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