Qualcomm Incorporated (QCOM) and Hyundai Mobis have entered into a comprehensive agreement to jointly develop next-generation solutions for Software-Defined Vehicles (SDVs) and Advanced Driver Assistance Systems (ADAS). This partnership aims to enhance Qualcomm’s automotive solutions, leveraging its Snapdragon Ride Flex SoC, designed for efficient AI processing and real-time sensor fusion, targeting emerging markets.
Both companies plan to combine their software and chip technologies to create a scalable SDV architecture that is highly efficient, stable, and capable of over-the-air upgrades. This collaboration aims to reduce costs and improve system efficiency for automakers while simplifying system designs.
