Marvell’s 800 Gbps Optical Module Breakthrough: A Game-Changer Unveiled

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Marvell Technology, Inc MRVL is ready to unveil a groundbreaking showcase at OFC 2024, featuring a range of innovative products such as probabilistic constellation shaping (PCS), 3D Silicon Photonics Engine, 5nm 800 Gbps transmit-only PAM4 optical DSP, and 1.6 Tbps PAM4 optical DSP.

In a notable leap for data center interconnects, Marvell will introduce the first 800 Gbps ZR/ZR+ pluggable module with probabilistic constellation shaping (PCS) at OFC 2024. This unveiling will utilize Marvell’s Teralynx 10 switch and its 800 Gbps ZR/ZR+ modules to showcase an advanced network infrastructure.

Also Read: Marvell’s Latest Tech Leap with TSMC – A 2nm Chip Platform Set to Transform AI Infrastructure

PCS, a cutting-edge technology, enhances performance by adjusting coherent signal modulation for optimized transmission capacity or reduced spectrum and energy usage. It pushes optical fibers closer to the Shannon Limit, extending the reach of the COLORZ 800 module from 500km to 1000km at full capacity.

This week’s highlight from Marvell is the debut of its 3D Silicon Photonics (SiPho) Engine, a milestone for the industry. This groundbreaking engine integrates 32 channels with 200G electrical and optical interfaces, enabling multi-terabit speed connections between AI clusters and cloud data centers. The Marvell 3D SiPho engine consolidates various components into a single apparatus, boosting optical interconnect performance, bandwidth, and energy efficiency. With double the bandwidth and input/output density and a 30% reduction in power consumption per bit, this device surpasses its 100 Gbps predecessors.

Marvell introduces the Spica Gen2-T, featuring a 5nm 800 Gbps transmit-only PAM4 optical Digital Signal Processor (DSP). This innovation, designed for transmit retimed optical modules (TRO modules), drastically improves power efficiency by reducing over 40% of power consumption in 800 Gbps optical modules. It remains compatible with standard optical modules and IEEE 802.3-compliant host devices.

Driven by the demands of cloud computing and AI, service providers are seeking to enhance their optical interconnect networks with higher bandwidth optical modules to integrate growing accelerators into single compute nodes.

Marvell meets this challenge by consistently enhancing power and cost efficiency across its optical DSP generations. The company tailors solutions to specific operational requirements and emerging applications, including new module categories like TRO modules.

Marvell reveals the Marvell Nova 2, a 1.6 Tbps PAM4 optical Digital Signal Processor (DSP) that stands as the industry’s first with 200 Gbps electrical and optical interfaces. This innovation caters to the evolving performance needs in accelerated infrastructure, generative AI, and high-performance computing sectors.

Furthermore, Marvell announces the general availability of its pioneering Nova optical DSP with a capacity of 1.6 Tbps, featuring 100 Gbps electrical and 200 Gbps optical interfaces unveiled last year. This significant advancement in optical connectivity will be showcased at OFC 2024 in San Diego, California.

The 1.6T Nova optical DSPs mark a transformative step in optical connectivity. They enable the development of optical modules in various industry-standard form factors, doubling the bandwidth of existing 800 Gbps versions, and facilitating a shift towards 200G interfaces. These DSPs enhance the bandwidth of optical modules and interfaces, allowing for substantial improvements in network traffic management within existing physical constraints, offering a scalable way to enhance infrastructure capacity and maximize returns on investments.

Marvell’s stock has surged over 60% in the past year. Investors can access the stock through IShares U.S. Digital Infrastructure And Real Estate ETF IDGT and Spear Alpha ETF SPRX.

Price Action: MRVL shares traded lower by 0.70% at $66.04 on the last check Monday.

Also Read: Broadcom, Marvell Face Stock Dips Despite High Hopes in AI Chip Sector

Disclaimer: This content was partially produced with the help of AI tools and was reviewed and published by Benzinga editors.

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