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Applied Materials (AMAT) has introduced three new semiconductor manufacturing systems aimed at meeting rising demand for AI infrastructure, including the Kinex Bonding System, Centura Xtera Epi System, and PROVision 10 eBeam Metrology System. These innovations enhance production capabilities for AI chips and address major device inflections in logic, memory, and packaging for 2nm nodes.
The Kinex Bonding System is the first integrated die-to-wafer hybrid bonder, optimizing accuracy and consistency while reducing power use. The Centura Xtera Epi System aims to cut gas use by 50% and improve transistor reliability, and the PROVision 10 eBeam Metrology offers 50% higher image resolution alongside 10x faster imaging performance.
Applied Materials shares have gained 38.3% year-to-date against the industry growth of 39.8%. The company currently has a forward price-to-sales ratio of 6.18, below the industry average of 9.41. The consensus estimate for fiscal 2025 earnings shows a projected year-over-year growth of 8.21%, although this estimate has been revised downward recently.
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